Brotech SDF-E semirotational label processing and finishing system
The Brotech SDF-E is a state-of-the-art solution featuring a modular design that enables the flexo and die-cutting units to operate in semi-rotary mode, making it an exceptionally cost-effective and versatile machine. With a wide range of configuration options, the system can be fully customized to meet individual production requirements, maximizing operational efficiency and flexibility.
Available modular options include additional flexo units for varnishing, printing, and cold foiling/laminating in a single pass. Optional enhancements such as hot-air drying (I/R), an automatic slitting system, a sheeting module, and IML stations further expand the machine’s versatility and range of applications.
With its compact design and short web path, the machine minimizes material waste while ensuring maximum cutting precision and perfect fit accuracy.
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Product information
Specification(with standard configuration)
| MODEL | SDF-E 330 | SDF-E 420 | SDF-E 520 |
| Maximum web width | 340mm | 430mm | 530mm |
| Maximum diameter of unwind reel | 700mm | 700mm | 700mm |
| Maximum diameter of the rewind reel | 600mm | 600mm | 600mm |
| Maximum die cutting width | 330mm | 420mm | 520mm |
| Maximum speed of semi-rotary die-cutting | 70m/min | 70m/min | 70m/min |
| Maximum report at semirotary die-cutting | 457mm | 457mm | 457mm |
| Maximum working speed | 130m/min | 130m/min | 130m/min |
| Die cutting tolerance | ±0.15mm | ±0.15mm | ±0.15mm |
| Air supply | 8bar | 8bar | 8bar |
| Power supply | 3PH+N+PE | 3PH+N+PE | 3PH+N+PE |
| Size | 4.9×3.1×2.3m | 4.9×3.2×2.3m | 4.9×3.3×2.3m |
| Weight | 2.5T | 2.8T | 3T |
Print substrate(with standard configuration)
The standard thickness of the material is 35-250µm(the range can be increased). It is possible to cut film, paper, thin cardboard. It is possible to adapt the machine to cut other substrates.
Description of the units
Full/Semi Rotation Flexo Unit:
Patented “on the fly” technology allows the operator to change the station’s mode of operation from half rotation to full rotation and vice versa.
Full/semi rotation die cutting unit:
The patented “on the fly” technology allows the operator to change the station’s operation mode from half rotation to full rotation and vice versa. It can be equipped with either magnetic cylinders or a full die-cutting cylinder.
Application
Electronics, cosmetics, packaging, pharmaceuticals, toys, logistics, apparel, security.
Available options:
- Set of air shafts from 1″ to 6+”
- Additional flexo station
- Additional die cutting station
- Handling thicker material up to 400µm
- In-mould(IML) label table
- Automatic slitting unit
- Drying with hot air